AMP 3000 selective EMC metallization
LPKF Laser & Electronics SE · Packaging processes and engineering validation
- Purpose
- Conductive mold-surface structures need assessment of metallization, grounding and electromagnetic use.
- Technical approach
- LDS processes compatible EMC before selective copper plating.
- Scope of use
- Consider compatible mold compounds for package antennas, interconnects or EMI shields.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsAntenna performance does not establish shielding effectiveness. Historical examples do not qualify project grounding, adhesion or electromagnetic behavior.
What to prepareBLNKK suggests preparing EMC, metallization/grounding designs, frequency bands and measurement boundaries, with adhesion, continuity and EMI results.
Confirm with the supplierConfirm materials, machine configuration, laser/plating windows and validation of the actual grounded structure.
- Public evidence
- The current finder lists AMP 3000; a dated 2021 release describes AMP and its applications.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.