NEXAR Bond laser-fused glass caps

LPKF Laser & Electronics SE · Packaging processes and engineering validation

Purpose: Glass-cap and photonic packaging needs a joining approach matched to seam geometry and nearby temperature-sensitive structures.
Technical approach: Tensor Bonding locally laser-fuses glass interfaces to create glass-to-glass seams without bonding adhesive.
Scope of use: Consider it for glass caps and layered glass assemblies, with glass pairing, gaps and component layout assessed for the project.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It is not a metal-lid adhesive or Cu hybrid-bonding process. Published bonding capabilities do not establish package-specific hermetic or reliability qualification.
What to prepare
BLNKK suggests preparing glass specifications, interface gaps, seam drawings and nearby component temperature limits.
Confirm with the supplier
Confirm the current configuration and material/gap capability, and validation arrangements for seam strength, leakage and thermal cycling.
Public evidence: The product page describes laser fusion, M/S/P handling configurations and glass-cap and photonic applications.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.