PCO pressure cure for package adhesives

Heller Industries, Inc. · Packaging processes and engineering validation

Purpose: Underfill or lid-adhesive voids and adhesion need comparison of actual cure conditions.
Technical approach: PCO uses convection heating under pressure; an initial vacuum stage is optional.
Scope of use: Consider underfill, lid adhesives or panel curing matched to the material and configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Pressure does not guarantee void removal or complete cure, or replace fill and surface control. Device and adhesive pressure tolerance require confirmation.
What to prepare
BLNKK suggests preparing material details, fill/cure history, void locations, actual temperature/pressure traces and cure or adhesion results.
Confirm with the supplier
Confirm chamber and vacuum options, compatibility and the pressure window, then discuss sample-based cure and void validation.
Public evidence: Heller's product and packaging pages describe pressure curing and these applications.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.