PCO pressure cure for package adhesives
Underfill or lid-adhesive voids and adhesion need comparison of actual cure conditions.
Heller Industries, Inc.
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View contact information ↓Public capability summary
- Packaging adhesive-cure and solder-reflow equipment.
Other names: Heller · Heller Industries
Applications: Underfill / lid adhesives and panels · Solder joints / die attach
Catalog solutions · 2
Heller vacuum solder reflow
Solder-void reduction needs vacuum control without introducing splash or component displacement.
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Public sources
Contact information
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The form covers reflow equipment and semiconductor pressure curing ovens; specify the product and process. The Taiwan number is the supplier-published sales contact Arthur Liang, and the China mailbox belongs to its local sales director. After-sales service has a separate mailbox. Official source ↗
United States · Headquarters · Sales inquiries
Heller Industries, Inc. — US Headquarters / Sales
- Phone
- +1 973 3776800
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Heller Taiwan Ltd. — Arthur Liang
- Phone
- +886 975 039150
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Heller Industries China — CY Chu, China Vice Sales Director
- Phone
- +86 21 64426180
Official source ↗Source checked
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