SDH-4550L package EMI-shield sputtering
ULVAC, Inc. · Packaging processes and engineering validation
- Purpose
- Compare exterior package shielding processes for interference affecting RF devices; first establish the relevant coupling path.
- Technical approach
- A load-lock rotating-drum system deposits EMI shielding films by low-temperature sputtering.
- Scope of use
- Consider package geometry, exposed coating areas, masking and grounding when assessing the proposed configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCoating alone does not establish interference suppression. Film continuity, grounding and uncovered paths still matter; “low temperature” does not establish compatibility with every package material.
What to prepareBLNKK suggests preparing frequency bands, test conditions, package drawings, coating exclusions and grounding design. Existing thickness, adhesion or EMI comparisons can help define a sample trial.
Confirm with the supplierAsk about film materials, temperature, fixtures and masking, then agree on continuity and adhesion checks. Confirm shielding performance under matched test conditions and the required production cycle.
- Public evidence
- ULVAC describes SDH-4550L production use but publishes no universally applicable shielding attenuation or numerical process-temperature window on this page.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.