NA-1500 panel organic-residue plasma removal
Post-opening organic residue and surface condition need assessment alongside subsequent metal contact.
ULVAC, Inc.
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Vacuum thin-film deposition and plasma surface-processing equipment.
Other names: ULVAC · 愛發科 · 爱发科
Applications: FO-PLP surfaces / openings · PCB-interposer seed metal · Exterior package EMI shields
Catalog solutions · 3
SMV-500F interposer Ti/Cu seed sputtering
Seed-layer coverage and continuity before plating need correlation with subsequent copper fill.
SDH-4550L package EMI-shield sputtering
Compare exterior package shielding processes for interference affecting RF devices; first establish the relevant coupling path.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Public sources
Contact information
Contact the supplier directly through its official channels.
The primary form is operated by ULVAC Taiwan, with Semiconductor Industry and Product Inquiry categories. A separate US form accepts North and South American inquiries; other regions can use the Japan product-category contact entry. The listed equipment-business numbers are not shared contacts for every specialist subsidiary. Official source ↗
United States · Supplier office
ULVAC Technologies, Inc. — Methuen
- Phone
- +1 978 6867550
Official source ↗Source checked
Taiwan · Supplier office
ULVAC Taiwan Inc. — 優貝克科技，新竹本社
- Phone
- +886 3 5795688
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
ULVAC (Shanghai) Trading Co., Ltd.
- Phone
- +86 21 62176618
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
Supplier updates and ownership →
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.