SMV-500F interposer Ti/Cu seed sputtering
ULVAC, Inc. · Packaging processes and engineering validation
- Purpose
- Seed-layer coverage and continuity before plating need correlation with subsequent copper fill.
- Technical approach
- SMV-500F sputters Ti/Cu seed metal with substrate cooling.
- Scope of use
- ULVAC explicitly names PCB interposers; geometry and material suitability require confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPCB-interposer use does not establish continuous coverage in high-aspect-ratio TSVs or compliance with every substrate's thermal limit.
What to prepareBLNKK suggests preparing geometry, target thickness, surface and thermal-budget details, then correlating cross-sections and electrical measurements with fill results.
Confirm with the supplierConfirm substrate/chamber configuration, Ti/Cu stack and cooling, plus geometry-specific coverage, continuity and adhesion validation.
- Public evidence
- The product page documents seed sputtering and cooling, without project-specific internal coverage evidence.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.