BATCHSPRAY Acid RDL seed / barrier wet etch
siconnex customized solutions GmbH · Packaging processes and engineering validation
- Purpose
- Compare post-plating RDL seed/barrier removal, balancing residual conductive metal against undercut and line loss.
- Technical approach
- Batch wafer rotation and chemical spray combine with tank recirculation. Optical-reflection endpoint sensing supports metal-etch control.
- Scope of use
- Assess the actual metal stack, dielectric compatibility and layout using the proposed chemistry and representative samples.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsUniformity and endpoint sensing do not independently establish line isolation or eliminate undercut. Family-level performance figures are not universal specifications for this configuration.
What to prepareBLNKK suggests preparing stack thicknesses, line/space dimensions, dielectrics and current etch history. Residue images, dimensional loss and short locations can guide matched comparisons.
Confirm with the supplierConfirm chemistry, selectivity, endpoint interpretation, recirculation management and over-etch control. Agree on sample checks for remaining metal, line loss and electrical isolation.
- Public evidence
- The equipment page describes Acid Autoload; a separate Siconnex article discusses RDL removal and its failure modes. Neither qualifies your layout.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.