BATCHSPRAY Acid RDL seed / barrier wet etch
Compare post-plating RDL seed/barrier removal, balancing residual conductive metal against undercut and line loss.
siconnex customized solutions GmbH
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View contact information ↓Public capability summary
- Batch-spray wafer wet-processing equipment.
Other names: Siconnex · BATCHSPRAY
Applications: Post-plating RDL metal isolation
Catalog solutions · 1
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Contact information
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For cleaning, etching and resist-strip equipment, select Sales/Products under Department and describe the wafer or packaging process and equipment requirements. The phone and mailbox provide general routing through the Austrian headquarters. Official source ↗
Austria · Headquarters
siconnex customized solutions GmbH — Headquarters / General Routing
- office@siconnex.com
- Phone
- +43 6229 36 646 0
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