ARAMIS board loading and deformation comparison

ZEISS Industrial Quality Solutions · Engineering measurement and characterization

Purpose: Pad-cratering assessment needs board deformation correlated with fixtures, loading and failure timing.
Technical approach: DIC and point tracking measure visible surface strain, displacement and deformation, with external signal synchronization.
Scope of use: Consider controlled board-loading tests with visible, trackable surfaces and appropriate camera configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It cannot directly view buried pads or identify a failure layer from surface strain alone. Occlusion, patterns, calibration and fixtures affect interpretation.
What to prepare
BLNKK suggests preparing board/fixture details, load history, tracking areas and failure timing, correlated with electrical and fracture observations.
Confirm with the supplier
Confirm cameras/lenses, field and recording rate, calibration/synchronization and achievable spatial/temporal resolution for the specimen.
Public evidence: ZEISS documents full-field/point measurements, camera variants and force-signal synchronization.

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