Xradia Versa non-destructive 3D X-ray microscopy for packages
Locate buried voids, cracks and interconnect features before sectioning; visibility of a narrow TSV seam needs a representative sample trial.
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View contact information ↓Other names: ZEISS
Applications: 2.5D, 3D, RF and electronic packages · Board fixture/load tests · Free/supported panels · Heat spreaders/supports
Locate buried voids, cracks and interconnect features before sectioning; visibility of a narrow TSV seam needs a representative sample trial.
Pad-cratering assessment needs board deformation correlated with fixtures, loading and failure timing.
Compare exposed panel geometry in free or defined support states, with a common reference before and after handling.
Check accessible heat-spreader or support-part dimensions, datums and form before assessing TIM contact.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Contact the supplier directly through its official channels.
Route Xradia inquiries through Microscopy and ATOS, ARAMIS or O-INSPECT inquiries through Industrial Metrology. The listed US email and phone provide metrology support; use the general inquiry form for product inquiries. Official source ↗
United States · Supplier office · Technical support
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Taiwan · Supplier office
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Mainland China · Supplier office
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Taiwan · Supplier office
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.