Xradia Versa non-destructive 3D X-ray microscopy for packages

ZEISS · Warpage, topography and stress metrology

Purpose: Locate buried voids, cracks and interconnect features before sectioning; visibility of a narrow TSV seam needs a representative sample trial.
Technical approach: Geometric and optical magnification capture X-ray projections for 3D reconstruction and virtual sections. RaaD supports targeted imaging within intact samples.
Scope of use: For electronics-package structural inspection, process development and failure analysis, with follow-on FIB/SEM investigation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Validate visibility for the actual materials and scan settings; voxel size is not spatial resolution. Reconstruction and measurement modules depend on configuration.
What to prepare
BLNKK suggests preparing sample dimensions, stack materials, target defect sizes and locations, reference samples and the sectioning plan.
Confirm with the supplier
Confirm sample contrast, scan time, artifact handling, coordinate export and required reconstruction or measurement modules.
Public evidence: The August 2021 electronics brochure illustrates TSV voids and bump defects; the current page describes multi-scale imaging and reconstruction tools.

Supporting references

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