Taiyo Ink PSR-800 package solder-mask material

TAIYO INK MFG. CO., LTD. · Material properties and interface engineering

Purpose: Solder-bridging comparisons need pad, mask-opening and solder-volume data alongside material selection.
Technical approach: PSR-800 is dry-film solder resist for IC package substrates, forming permanent mask coverage and soldering openings.
Scope of use: Consider package-substrate mask designs, with the grade, thickness, openings and process confirmed.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
It cannot repair an existing bridge. Product listings do not establish fine-pitch package qualification or replace solder-volume/reflow control.
What to prepare
BLNKK suggests preparing pad/opening drawings, pitch, thickness, alignment/curing records and solder/reflow conditions.
Confirm with the supplier
Confirm the grade, processing window and compatibility, plus sample checks for opening quality, bridging and assembly reliability.
Public evidence: Official pages list AUS410/AUSSR1 grades and identify solder resist as package-board material.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.