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TAIYO INK MFG. CO., LTD.

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Public capability summary

  • Package solder masks, build-up dielectric films and permanent hole-plugging materials.
Material properties and interface design

Other names: Taiyo Ink · TAIYO INK MFG. · 太陽油墨

Applications: Package pad/solder-mask opening comparison · CAF stack/spacing material comparison · Hole-fill material/CAF spacing comparison

Catalog solutions · 3

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Public sources

Contact information

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Use the Electronics Products form and specify the product and process. The Silicon Valley office explicitly covers IC packaging materials. Taiwan and Shenzhen contacts primarily cover PCB materials; confirm coverage for other products. Official source ↗

United States · Supplier office · Sales inquiries

Taiyo America, Inc. — Silicon Valley Marketing Office / IC Packaging Materials

Official source ↗Source checked

Mainland China · Supplier office · Sales inquiries

Taiyo Ink Trading (Shenzhen) Co., Ltd. — PCB Materials Sales

Official source ↗Source checked

More regional contacts (2)

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.