Taiyo Ink Zaristo125G build-up dielectric film

TAIYO INK MFG. CO., LTD. · Material properties and interface engineering

Purpose: CAF leakage investigation needs dielectric materials compared under matched spacing and moisture-bias conditions.
Technical approach: Zaristo125G is an epoxy-based, thermally cured interlayer insulating film used with SAP after lamination and curing.
Scope of use: Consider it for build-up board dielectric evaluation; confirm packaging use and compatibility with the actual stack.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The public material does not establish CAF qualification for a specific stack or a drop-in ABF replacement. Material selection does not locate or repair existing leakage.
What to prepare
BLNKK suggests preparing stack details, conductor/via spacing and moisture-bias history, with matched candidate-film and control coupons.
Confirm with the supplier
Confirm board and packaging uses, lamination/cure windows, roughening and plating compatibility, and insulation-reliability evidence under relevant conditions.
Public evidence: The Japanese product page documents 125G and its lamination, curing, laser-drilling and copper-deposition process.

Supporting references

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