Taiyo Ink THP-100 permanent hole-plugging compound
TAIYO INK MFG. CO., LTD. · Material properties and interface engineering
- Purpose
- Hole-plugging comparisons need hole-wall, resin and adjacent-conductor conditions correlated with moisture-bias leakage.
- Technical approach
- THP-100 resin ink fills copper-plated core-board through-holes through printing, thermal curing and buffing.
- Scope of use
- The official page distinguishes DX for package boards and Z for general multilayer boards; match the grade to the hole structure.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPackage-board use does not establish project-specific CAF or insulation qualification. Plugging neither plates copper nor repairs leakage, and grade-specific processes are not interchangeable.
What to prepareBLNKK suggests preparing hole/plating geometry, spacing, process history and cross-sections for matched moisture-bias and fill-quality comparisons.
Confirm with the supplierConfirm DX1/Z2 selection, hole-wall and subsequent-process compatibility, cure/buffing windows, and appropriate void, shrinkage and insulation assessments.
- Public evidence
- The Japanese technical page names DX1/Z2 and describes their permanent plugging process.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.