Nippon Micrometal EX bonding wire

Nippon Micrometal Corporation · Material properties and interface engineering

Purpose: Compare wire, pad, diameter and loop choices in a bond-lift or heel-fatigue investigation.
Technical approach: Pd-coated Cu wire forms die-to-package interconnects; some grades add an Au surface layer.
Scope of use: Assess the selected grade together with pad metallurgy, loop geometry and bonding conditions in a new process trial.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Coatings and humidity/temperature positioning differ by grade. Qualification statements cannot cover the entire family or your assembly; changing wire does not repair existing lift or cracks.
What to prepare
BLNKK suggests preparing grades, diameters, pad metallurgy, loop drawings and bonding parameters. Pull/shear failure locations and thermal/humidity records can guide matched comparisons.
Confirm with the supplier
Confirm grade/pad compatibility, suggested bonding window and storage. Agree on loop, failure-location and actual-load comparisons, and clarify the scope of any qualification statement.
Public evidence: Nippon Micrometal distinguishes EX grade features, but provides no qualification or fatigue-life result for your package/loop.

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