Nippon Micrometal EX bonding wire
Compare wire, pad, diameter and loop choices in a bond-lift or heel-fatigue investigation.
Nippon Micrometal Corporation
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Semiconductor bonding wire and micro solder balls.
Other names: Nippon Micrometal · NMC · 日鐵微金屬 · 日铁微金属
Applications: Bonding-wire material/fatigue comparison · Ball-forming/coplanarity material comparison
Catalog solutions · 2
Nippon Micrometal LF micro solder balls
Compare incoming balls and assembled heights to separate diameter variation, attachment/reflow and package shape in coplanarity assessment.
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Public sources
Contact information
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Use Nippon Micrometal’s inquiry form for bonding wires and micro solder balls. The Japan phone reaches Iruma headquarters; the China number reaches its Hangzhou subsidiary. The listed email is the parent company’s routing mailbox published on its Micro Ball page, not a dedicated Micrometal sales address. Official source ↗
Mainland China · Supplier office
Nippon Micrometal (Hangzhou) Co., Ltd.
- Phone
- +86 571 2893 9101
Official source ↗Source checked
Japan · Headquarters
Nippon Micrometal Corporation — Iruma Head Office
- Phone
- +81 4 2934 6101
Official source ↗Source checked
Japan · General contact · Sales inquiries
Nippon Steel Chemical & Material — Micro Ball Inquiry Routing
Official source ↗Source checked
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