Nippon Micrometal LF micro solder balls

Nippon Micrometal Corporation · Material properties and interface engineering

Purpose: Compare incoming balls and assembled heights to separate diameter variation, attachment/reflow and package shape in coplanarity assessment.
Technical approach: Microballs supply solder metal and initial geometry; LF offers distinct alloy and size choices.
Scope of use: Published applications include BGA, CSP and flip-chip. Match grade to pads, target diameter and the intended reflow process.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Incoming diameter tolerance does not establish assembled height or coplanarity. Grade-specific drop/fatigue positioning is not interchangeable qualification or repair of existing failed joints.
What to prepare
BLNKK suggests preparing grade/lot tolerances, pad geometry/surface, attachment/reflow history and per-ball height baselines. Record support and temperature to separate ball shape from overall package warp.
Confirm with the supplier
Confirm alloy, diameter/lot tolerance, oxidation/storage controls and reflow window. Agree on assembled height, coplanarity and electrical checks; reliability conclusions require matched package/test conditions.
Public evidence: Nippon Micrometal lists LF60/LF35/LF45 compositions and grouped diameter tolerances, not an assembled-coplanarity result for your package.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.