ASAP-1 IPS local decapsulation and thinning

ULTRA TEC Manufacturing, Inc. · Packaging processes and engineering validation

Purpose: After electrical localization, a microbump anomaly may need exposure for physical examination.
Technical approach: Localized mechanical removal, thinning and polishing use live machine vision for navigation and preparation control.
Scope of use: Consider die, package, module or wafer samples permitting removal, with target and endpoint planned.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Preparation changes the sample and can damage interconnects; it does not establish electromigration or resistance-degradation causes.
What to prepare
BLNKK suggests preparing target coordinates, material stacks and existing electrical/imaging records, with permitted removal and observation endpoints specified.
Confirm with the supplier
Confirm tooling, mounting, endpoint control and options such as image overlay or curvature correction, and checks for preparation damage.
Public evidence: The ASAP-1 IPS page describes these operations and distinguishes optional modules.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.