ASAP-1 IPS local decapsulation and thinning
After electrical localization, a microbump anomaly may need exposure for physical examination.
ULTRA TEC Manufacturing, Inc.
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View contact information ↓Public capability summary
- Selected-area preparation and optical-fiber end-face processing equipment.
Other names: ULTRA TEC · Ultra Tec
Applications: Local semiconductor-package physical analysis · Bare-fiber end faces and optical coupling trials
Catalog solutions · 2
ULTRAPOL Fiberlab bare-fiber tip preparation
Fiber-attachment loss comparison needs end geometry separated from coupling and fixing conditions.
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Contact information
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Use the general inquiry form for electronic failure analysis, decapsulation and sample-preparation equipment, specifying the product, application and location. The supplier asks users to request local representative details through the form; the verified US headquarters contact is listed here. Official source ↗
United States · Headquarters
ULTRA TEC Manufacturing, Inc. — Santa Ana / General Product Inquiries
- info@ultratecusa.com
- Phone
- +1 714 542 0608
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