MultiPrep targeted cross-section polishing

Allied High Tech Products, Inc. · Packaging processes and engineering validation

Purpose: Via-fill void investigation needs a selected via located in an observable section.
Technical approach: MultiPrep controls specimen pitch/roll, Z position and material removal for parallel, angular or site-specific polishing.
Scope of use: Consider destructive substrate/package preparation with material-specific fixtures and abrasives.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A section may miss the target void and does not alone establish an original fill defect. BLNKK advises checking smear, pull-out and section-offset artifacts.
What to prepare
BLNKK suggests preparing locations/imaging, layer details, section direction and controls, with cutting/mounting/polishing and removal history retained.
Confirm with the supplier
Confirm fixtures, platens, abrasives, targeting/stopping and microscopy or repeat-section checks for location and preparation quality.
Public evidence: The official page documents orientation/removal control and separately sold fixtures and platens.

Contact the supplier

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