kSA MOS ThermalScan temperature-dependent wafer curvature and film-stress metrology
k-Space Associates · Warpage, topography and stress metrology
- Purpose
- Annealing and thermal cycling change wafer curvature, bow and film stress. Temperature-dependent data support process comparisons and material-model calibration.
- Technical approach
- A multi-beam optical sensor uses a laser array to track reflected-spot changes and derive curvature, bow and stress data during programmed heating under vacuum or process gas.
- Scope of use
- TS300-HT holds 300-mm wafers and line-scans to 1000°C. Area scanning needs an optional second lid and is limited to 600°C; ramping uses center-point acquisition, while area mapping requires stabilized temperature.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations1000°C line scanning does not imply full-area mapping at that temperature, and ramp center-point data are not dynamic full-field maps. Stress conversion and quoted accuracy depend on specimen and material assumptions.
What to prepareBring sample dimensions, surface/film information, thickness/modulus data, thermal and atmosphere requirements, and the desired point/line/area scan and acceptance region.
Confirm with the supplierConfirm HT/MT model, lid and cooling options, scan coverage and temperature calibration. Request representative-sample evidence for signal quality, repeatability and data available during the thermal recipe.
- Public evidence
- The January 2026 specification separates models, scan modes and temperatures. Stated accuracy on 300-mm wafers requires central 200-mm scanning, with additional specimen assumptions for stress accuracy.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.