kSA MOS ThermalScan temperature-dependent wafer curvature and film-stress metrology
Annealing and thermal cycling change wafer curvature, bow and film stress. Temperature-dependent data support process comparisons and material-model calibration.
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View contact information ↓Applications: Wafers, thin films and annealing · Optically accessible process wafers
Annealing and thermal cycling change wafer curvature, bow and film stress. Temperature-dependent data support process comparisons and material-model calibration.
TSV stress-model thermal histories need actual process-wafer temperature references.
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The manufacturer lists Japan-based R-DEC as its distributor for Taiwan; this is not a Taiwan office. Use the requestinfo mailbox for general product inquiries. The Request Support form primarily handles existing-system support. Official source ↗
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Mainland China · Supplier-listed distributor · Sales inquiries
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United States · Supplier office · Sales inquiries
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Japan · Supplier-listed distributor · Sales inquiries
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