RMV vacuum lamination for organic substrates

Maschinenfabrik LAUFFER GmbH & Co. KG · Packaging processes and engineering validation

Purpose: Prepare stack/process control coupons for a CAF or substrate-leakage investigation, correlating lamination history with subsequent insulation results.
Technical approach: Thermal-oil-heated RMV presses laminate materials under agreed vacuum, temperature and pressure conditions for the selected configuration.
Scope of use: LAUFFER lists PCB, CCL and IC-substrate applications; confirm RMV format, stack and process window.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A press does not establish CAF resistance. Portfolio-wide ratings, start/transfer modes and data-management features are not automatically available on every RMV.
What to prepare
BLNKK suggests preparing resin/glass/copper stacks, dimensions, lamination/storage history, failed/control samples and available leakage, bias and humidity data.
Confirm with the supplier
Confirm configuration, material compatibility, vacuum/temperature/pressure and cooling/transfer procedures. Agree on available process records and separate CAF/insulation testing and acceptance criteria.
Public evidence: The current page and L011 brochure describe modular RMV configurations, without substrate-specific CAF or leakage validation.

Supporting references

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