UVKO epoxy transfer molding
Incomplete mold-fill comparison needs material flow correlated with cavity geometry and injection history.
Maschinenfabrik LAUFFER GmbH & Co. KG
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Transfer-molding and vacuum-lamination press systems.
Other names: LAUFFER · LAUFFER Pressen
Applications: Epoxy encapsulation of electronic assemblies · PCB, CCL and organic-substrate lamination
Catalog solutions · 2
RMV vacuum lamination for organic substrates
Prepare stack/process control coupons for a CAF or substrate-leakage investigation, correlating lamination history with subsequent insulation results.
Candidates in engineering problem guides
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Public sources
Contact information
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For semiconductor encapsulation equipment, select Encapsulation Technology and describe the process and equipment requirements. Hefei is the manufacturer’s China company; PTI is a supplier-listed US sales partner. Confirm product and territorial coverage with PTI. Official source ↗
United States · Supplier-listed distributor
Production Technologies International (PTI)
- tim@ptiusallc.com
- Phone
- +1 313 378 3808
Official source ↗Source checked
Mainland China · Supplier office
Lauffer Machinery Technology Hefei Co., Ltd.
- chen.lei@lauffer.de
- Phone
- +86 182 6975 5777
Official source ↗Source checked
Germany · Headquarters
Maschinenfabrik Lauffer GmbH & Co. KG — Horb Headquarters / General Routing
- Phone
- +49 7451 902 0
Official source ↗Source checked
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.