Precision glass carriers for lower-warpage advanced packaging
Corning · Material properties and interface engineering
- Purpose
- Thin wafers and fan-out panels need stable support during thinning, temporary bonding and handling, with control of deformation from carrier/product thermal-expansion differences.
- Technical approach
- Precision glass provides temporary support through selectable CTE, stiffness and low thickness variation. Optical transparency can support UV/IR or laser debonding when matched with the adhesive and process.
- Scope of use
- Corning lists wafer thinning, fan-out and 2.5D/3D packaging, with wafer and panel formats. Panel examples include 515×510 mm and 600×600 mm.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsGlass families have different specifications; a series-wide CTE range does not apply to every grade. Validate the product/carrier/adhesive/thermal process together rather than assume 40% warp reduction.
What to prepareBring wafer/panel dimensions, stack-up and materials, temperature range, existing warp and handling conditions, plus temporary-bond adhesive and debond method to plan carrier selection.
Confirm with the supplierConfirm glass family, dimensions, thickness, TTV/flatness and CTE specifications with test conditions. Ask about adhesive/debond compatibility, edge strength, reuse and actual-process trials.
- Public evidence
- The current series page lists CTE choices spanning 3.4–12.6 ppm/°C; January 2019 sheets distinguish individual families. Up-to 40% process-warp reduction is a supplier claim without a published universally applicable test basis.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.