Precision glass carriers for lower-warpage advanced packaging
Thin wafers and fan-out panels need stable support during thinning, temporary bonding and handling, with control of deformation from carrier/product thermal-expansion differences.
Corning
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- Precision glass carriers for lower-warpage advanced packaging · Material properties and interface engineering
- Corning fiber array units for CPO · Package architecture and warpage compensation
Applications: FOWLP, FOPLP, 2.5D and 3D · Silicon-photonics/CPO fiber attachment
Catalog solutions · 2
Corning fiber array units for CPO
CPO fiber attachment needs array geometry matched to the chip interface to assess alignment and post-attach coupling loss.
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Contact information
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United States · Supplier office
Corning — Semiconductor Technology & Solutions
- Phone
- +1 607 974 9000
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Taiwan · Supplier office
Corning International — Taiwan Office
- Phone
- +886 2 2716 0338
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