CrackScan optical wafer crack inspection

ISRA VISION · Engineering measurement and characterization

Purpose: Inspect wafer-body cracks after grinding and before polishing, relating defect locations to process stages for damage investigation and sorting.
Technical approach: Optical line-scan cameras locate cracks inside wafer material, with tailored optics and standalone or production-line integration.
Scope of use: The documented application is bulk-wafer inspection. Evaluate the actual ultrathin wafer, carrier or post-debond structure with samples.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Images alone do not identify grinding/debond causality. Visibility is not established for every carrier/material/thickness; speed and microcrack marketing descriptions are not sample-specific acceptance values.
What to prepare
BLNKK suggests preparing material/thickness and carrier/film details, before/after-process samples, known crack controls and reference results. Define inspection regions and target defects.
Confirm with the supplier
Confirm optical access, handling and crack visibility. Agree on detection/false-call validation, coordinate registration, integration and data output; confirm edge-inspection expansion separately.
Public evidence: ISRA VISION describes the optical method and process application, without a detection rate for your ultrathin stack.

Contact the supplier

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