CrackScan optical wafer crack inspection
Inspect wafer-body cracks after grinding and before polishing, relating defect locations to process stages for damage investigation and sorting.
ISRA VISION
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Provides industrial machine vision and optical wafer inspection systems.
Other names: ISRA VISION GmbH
Applications: Wafer grinding and debond damage · Post-singulation defect observation
Catalog solutions · 2
DicingScan dicing-street optical inspection
Post-dicing street position, completeness and visible chipping need comparison with cutting conditions.
Candidates in engineering problem guides
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Public sources
Contact information
Contact the supplier directly through its official channels.
Use the Semiconductors inquiry form and specify the product and application. Taiwan and Shanghai list a shared general mailbox. The US Atlas Copco IAS contact provides office/order routing, not a dedicated semiconductor-sales mailbox. Official source ↗
United States · Supplier office
ISRA VISION / Atlas Copco IAS — Auburn Hills
- Phone
- +1 248 373 3000
Official source ↗Source checked
Taiwan · Supplier office
ISRA VISION Taiwan — Taoyuan / General Office Routing
- info@isravision.com
- Phone
- +886 3 2500 148
Official source ↗Source checked
Mainland China · Supplier office
ISRA VISION Shanghai — General Office Routing
- info@isravision.com
- Phone
- +86 21 6850 0288
Official source ↗Source checked
More regional contacts (1)
Germany · Headquarters
ISRA VISION GmbH — Darmstadt Headquarters / General Routing
- info@isravision.com
- Phone
- +49 6151 948 0
Official source ↗Source checked
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.