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LEXT OLS5500 3D surface topography

Evident · Engineering measurement and characterization

Purpose
Compare accessible surface heights and local topography after TSV reveal.
Technical approach
LEXT OLS5500 combines laser scanning microscopy, white-light interferometry and focus variation.
Scope of use
Select optics and methods for the surface response and geometry; verify accessible regions on representative TSV samples.
Limitations and open questions

These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.

Scope and limitations

It does not measure buried voids or continuity, and general semiconductor use does not establish every TSV pitch. The stated guarantee requires specified calibration by authorized personnel.

What to prepare

BLNKK suggests preparing TSV geometry, exposed materials, optical response, target locations and representative samples with reference measurements.

Confirm with the supplier

Confirm method/lenses, visible sidewalls/bottoms, field of view/stitching, calibration, repeatability on actual surfaces and data export.

Public evidence
The named page lists three methods and semiconductor applications, with specified calibration conditions for its accuracy/repeatability guarantee.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.

Related engineering problems

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.