RO3000 RF circuit laminates
Rogers Corporation · Material properties and interface engineering
- Purpose
- Compare circuit-board dielectric options for RF interconnect design.
- Technical approach
- Named RO3003/RO3006/RO3010/RO3035 grades use ceramic-filled PTFE with different dielectric characteristics.
- Scope of use
- Consider RF and multilayer boards with grade, thickness, copper and fabrication conditions specified.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsDo not transfer properties between grades or series. Low-loss laminate does not guarantee complete-package insertion loss or compatibility with any RDL process.
What to prepareBLNKK suggests preparing frequency, stackup, trace/via geometry, copper and process details for comparisons at matched measurement reference planes.
Confirm with the supplierConfirm grade/configuration availability, applicable design dielectric/loss data, fabrication and multilayer conditions, specification values and lot documentation.
- Public evidence
- The official four-page sheet documents named materials, configurations and test conditions, separating typical from specification values.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.