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Rogers Corporation

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Public capability summary

  • Supplies RF circuit laminates, metallized ceramic substrates, liquid coolers and conductive bonding films.
Material properties and interface design

Other names: Rogers · curamik · COOLSPAN

Applications: RF circuits and package-to-board transitions · Power-module substrates and die-attach comparison · Power-electronics cooling and contact-interface design · Board-to-heat-spreader and RF housing bonding

Catalog solutions · 4

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Contact information

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Specify RF laminates or curamik ceramic-substrate/cooling products and use Advanced Electronics Solutions routing; the general form includes Product Inquiry. The Americas mailbox and Changhong distributor cover RF materials. US/Canada RF-material orders go through IEC; these are not dedicated curamik contacts. Official source ↗

More regional contacts (1)

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