curamik CoolPower liquid-cooling assemblies

Rogers Corporation · Material properties and interface engineering

Purpose: Assess liquid-cooling structure alongside the TIM/spreader interface, separating contact resistance from cooling-loop limitations.
Technical approach: Bonded copper layers form sealed channels. CoolPower Plus adds Al2O3/AlN DBC ceramics for isolation from the cooling circuit.
Scope of use: Confirm a custom design for the actual heat source, contact surface, cooling loop and insulation needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A cooler alone guarantees neither contact nor system thermal resistance. Basic CoolPower lacks the assumed Plus configuration. Rogers states custom curamik samples are unavailable; discuss prototypes separately.
What to prepare
BLNKK suggests preparing power/location, contact/clamping, TIM and dimensions, plus coolant, flow/pressure drop, inlet temperature and insulation requirements. Retain thermal controls.
Confirm with the supplier
Confirm design acceptance, coolant compatibility, leak/pressure checks and contact conditions. Agree on Plus isolation, prototype/quotation and assembly testing; do not borrow another cooler’s ratings.
Public evidence: Rogers documents the structures, not HBM-stack or abnormal-TIM-contact qualification.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.