COOLSPAN TECA conductive bonding film

Rogers Corporation · Material properties and interface engineering

Purpose: Assess board-to-metal bonding for heat transfer, electrical continuity and thermal-cure compatibility.
Technical approach: Silver-filled thermosetting epoxy film bonds boards to backplanes, heat-sink coins or RF housings through thermal cure/press processing.
Scope of use: Confirm surface finishes, bond geometry, press capability and conductive areas for the board-level assembly.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Conductive film is not electrical insulation or a direct replacement for removable TIM. Material conductivity is not interface resistance; cure pressure depends on geometry, planarity and thickness.
What to prepare
BLNKK suggests preparing materials/finishes, flatness, film/preform geometry and electrical keep-outs. Retain actual bondline temperature, pressure distribution and thermal/electrical/bond controls.
Confirm with the supplier
Confirm current specifications, storage/warm-up, preparation and cure at actual adhesive temperature. Agree on pressure/thickness control and assembly validation for voids, bonding, thermal/electrical response and subsequent processing.
Public evidence: Rogers lists these uses and processing guidance; datasheet properties are typical, not assembly specifications.

Supporting references

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