curamik metallized ceramic power substrates

Rogers Corporation · Material properties and interface engineering

Purpose: Power-die attachment assessment must consider substrate heat transfer, insulation and bonding surfaces.
Technical approach: curamik combines copper and ceramics through distinct DBC or AMB processes, with material/product choices confirmed separately.
Scope of use: Consider upstream substrates for power-module or sintered-silver attachment evaluation, subject to metallization and surface compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Substrate properties do not establish module thermal resistance, silver-joint strength or cycle life. Materials and bonding processes vary by series/design.
What to prepare
BLNKK suggests preparing die/substrate dimensions, copper patterns, ceramic/finish candidates and attachment temperature/pressure for design discussion.
Confirm with the supplier
Confirm ceramic/metallization options, finish and silver-attach compatibility, design acceptance, quotation, lead time and how evaluation pieces can be obtained.
Public evidence: Rogers documents named substrates and DBC/AMB technologies; its order page states curamik is customized and samples are unavailable.

Supporting references

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