Denka spherical alumina thermal fillers
Denka Company Limited · Material properties and interface engineering
- Purpose
- TIM and encapsulant formulations must balance heat conduction, particle size, dispersion and flow.
- Technical approach
- Denka supplies spherical alumina filler for resin/rubber, with particle-distribution, low-sodium and surface-treatment options.
- Scope of use
- Consider thermal-sheet, grease or encapsulant formulation development with resin, gap and filler loading defined.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsParticle and low-sodium characteristics are grade-specific. Powder data do not qualify finished conductivity, insulation, filling or contact thermal resistance.
What to prepareBLNKK suggests preparing resin, gap/bondline, loading and mixing details for dispersion, viscosity and finished-material comparisons.
Confirm with the supplierConfirm grade, particle distribution/coarse-particle control, impurities/finish, lot documentation and compatibility with the intended formulation.
- Public evidence
- The official body lists semiconductor thermal-sheet/encapsulant uses and distinct DAM, DAW and ASFP grades.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.