Denka spherical alumina thermal fillers
TIM and encapsulant formulations must balance heat conduction, particle size, dispersion and flow.
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View contact information ↓Other names: Denka · デンカ · 電化
Applications: TIM formulation and encapsulant filler selection · Power-module baseplates and semiconductor package lids · CPU/MPU cooling and thermal-contact comparison · Power-module circuit substrates and attachment comparison
TIM and encapsulant formulations must balance heat conduction, particle size, dispersion and flow.
Heat-spreader/baseplate selection must consider heat spreading, expansion and bonding surfaces.
Uneven surfaces and gaps require a compliant TIM within allowable assembly loads.
Power-die attachment comparison requires a defined ceramic insulator, conductor and bonding surface.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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Taiwan, China and US contacts are supplier-published company sales offices. The Japan number and linked form handle thermal plates, conductive sheets and gap-filling materials. For spherical fillers, ceramic powders or wafer-process tapes, choose the relevant department on the electronics contact page. Official source ↗
United States · Supplier office · Sales inquiries
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Taiwan · Supplier office · Sales inquiries
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Mainland China · Supplier office · Sales inquiries
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Japan · Supplier office · Sales inquiries
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