BLNKKSOLUTION NAVIGATOR
Menu

Denka Company Limited

Explore the supplier’s public information and its documented technical solutions.

View contact information ↓

Public capability summary

  • Offers electronic fillers, thermal interfaces, composite heat spreaders and ceramic circuit substrates.
Material properties and interface design

Other names: Denka · デンカ · 電化

Applications: TIM formulation and encapsulant filler selection · Power-module baseplates and semiconductor package lids · CPU/MPU cooling and thermal-contact comparison · Power-module circuit substrates and attachment comparison

Catalog solutions · 4

Candidates in engineering problem guides

These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.

Public sources

Contact information

Contact the supplier directly through its official channels.

Taiwan, China and US contacts are supplier-published company sales offices. The Japan number and linked form handle thermal plates, conductive sheets and gap-filling materials. For spherical fillers, ceramic powders or wafer-process tapes, choose the relevant department on the electronics contact page. Official source ↗

More regional contacts (1)

Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.

BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.