Denka flexible silicone thermal interface sheets

Denka Company Limited · Material properties and interface engineering

Purpose: Uneven surfaces and gaps require a compliant TIM within allowable assembly loads.
Technical approach: Ceramic-filled silicone pads contact components and heat sinks, with FSL grades offering different compliance and heat-transfer characteristics.
Scope of use: Consider CPU/MPU interfaces with thickness, compression and insulation needs defined.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Typical grade measurements do not guarantee actual package resistance or aging retention. This is not die-attach adhesive.
What to prepare
BLNKK suggests preparing gap, thickness, load limits, surfaces and thermal conditions for initial resistance and post-cycle thickness/distribution comparisons.
Confirm with the supplier
Confirm current FSL grade, thickness tolerances, load/compression data, insulation conditions, low-molecular siloxane needs and applicable aging tests.
Public evidence: The Japanese body confirms silicone; the catalog separates FSL grades, contact/compression tests and typical-value conditions.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.