Denka AN PLATE ceramic circuit substrates

Denka Company Limited · Material properties and interface engineering

Purpose: Power-die attachment comparison requires a defined ceramic insulator, conductor and bonding surface.
Technical approach: AN PLATE provides an AlN insulating/heat-conducting structure, with Denka production extending from AlN powder through copper bonding.
Scope of use: Consider power-module circuit substrates with actual grade and copper construction selected for thermal, insulation and cycling needs.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not transfer properties between AlN grades or from SN PLATE. Substrate data do not qualify silver attachment or module cycle life.
What to prepare
BLNKK suggests preparing geometry, copper/finish, attach material and heat/pressure histories for interface, insulation and cycle comparisons.
Confirm with the supplier
Confirm AN grade, ceramic/copper thickness, surface construction, supply documents and compatibility with actual attachment and validation conditions.
Public evidence: Named bodies distinguish AlN grades and document the subsidiary ceramic-to-circuit production flow.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.