Evonik AERODISP CMP silica dispersions

Evonik Operations GmbH · Material properties and interface engineering

Purpose: Assess a CMP abrasive ingredient in TSV-reveal/topography comparisons alongside removal selectivity, scratches and post-cleaning results.
Technical approach: W1836 supplies an aqueous hydrophilic fumed-silica dispersion for polishing formulations.
Scope of use: Evonik lists CMP/semiconductor polishing; assess actual exposed materials, chemistry, pad and cleaning together.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Abrasive alone establishes neither copper/dielectric selectivity nor scratch-free planarity. Evonik recommends protection from extreme heat/freezing and use within six months of manufacture.
What to prepare
BLNKK suggests preparing exposed materials/topography, chemistry, pad, removal and cleaning data. Record batch/manufacture/storage and retain controls, scratch/residue images.
Confirm with the supplier
Confirm current specifications, particle/aggregate distribution, chemistry/metal compatibility and storage/redispersion/filtration. Agree on actual CMP validation of selectivity, morphology and residues.
Public evidence: The current page and April 2021 document identify the material/use and typical properties, not a validated TSV formulation.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.