M-Series fan-out with Adaptive Patterning

Deca Technologies · Package architecture and warpage compensation

Purpose: Placement and molding variation in fan-out packaging can misalign die contacts and RDL routing.
Technical approach: Optical measurements drive designer-defined rules to generate per-unit patterns, implemented with maskless LDI for adaptive alignment and routing.
Scope of use: For single- and multi-die M-Series fan-out alignment; wafer/panel formats, architecture and layer count depend on the implementation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Compensation depends on contact/routing rules and implementation. Historical layer counts, yield or reliability examples are not family-wide guarantees.
What to prepare
BLNKK suggests preparing displacement/rotation distributions, contact/routing rules, panel format, measurement data and existing exposure/data workflows.
Confirm with the supplier
Confirm the M-Series architecture, APDK and allowed variation, measurement/LDI integration and pilot validation; define warpage acceptance separately.
Public evidence: Current pages explain measurement, design during manufacturing and LDI; the ISS 2019 presentation supplies historical alignment/routing examples.

Supporting references

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