M-Series fan-out with Adaptive Patterning
Placement and molding variation in fan-out packaging can misalign die contacts and RDL routing.
Deca Technologies
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- M-Series fan-out with Adaptive Patterning · Package architecture and warpage compensation
Applications: Chips-first fan-out and panel-level packages
Catalog solutions · 1
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United States · Headquarters
Deca Technologies Inc. — Tempe Headquarters
- info@thinkdeca.com
- Phone
- +1 480 345 9895
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