Bondjet ultrasonic bonding for power-module wires

Hesse GmbH · Packaging processes and engineering validation

Purpose: Compare loops and bonding conditions relevant to power-module heel/joint anomalies alongside fatigue and strength testing.
Technical approach: Bondjet ultrasonic wedge bonding forms heavy-wire/ribbon interconnects with programmable force, loop control and parameter monitoring.
Scope of use: BJ955/959/985 work areas differ; match Al, Cu or AlCu wire/ribbon with the head, tool, pads and geometry.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Real-time monitoring establishes neither fatigue life nor detection of every defect. Wire/ribbon size is application-dependent; confirm actual PiQC/pull configuration.
What to prepare
BLNKK suggests preparing wire/dimensions, pad metallization/surface, loop and bonding settings, pull/shear results, fracture locations and cycling-load records.
Confirm with the supplier
Confirm model/head/tool/material compatibility and monitoring/pull options. Agree on actual-module strength, failure-mode and cycling trials, including alarm criteria.
Public evidence: Official specifications describe heads, monitoring and optional PiQC/non-destructive pull, not this module’s cycling qualification.

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