Bondjet ultrasonic bonding for power-module wires
Compare loops and bonding conditions relevant to power-module heel/joint anomalies alongside fatigue and strength testing.
Hesse GmbH
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Ultrasonic wire/ribbon bonding and process-control equipment.
Other names: Hesse Mechatronics · Hesse
Applications: Power-module wire and ribbon interconnects
Catalog solutions · 1
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Public sources
Contact information
Contact the supplier directly through its official channels.
Contact regional sales for power-module wire bonding, with wire, bond-pad and sample details. Taiwan is served by a manufacturer-listed representative; Hesse Asia in Hong Kong handles the China/Hong Kong sales region. Official source ↗
United States · Supplier office · Sales inquiries
Hesse Mechatronics, Inc. — Irvine
- Phone
- +1 480 310 2034
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
Ye-Yang International Ltd. — New Taipei City
- Phone
- +886 976 379 309
Official source ↗Source checked
Germany · Headquarters · Sales inquiries
Hesse GmbH — Paderborn
- Phone
- +49 5251 1560 0
Official source ↗Source checked
More regional contacts (1)
Hong Kong · Supplier office · Sales inquiries
Hesse Asia Limited — Hong Kong
- Phone
- +852 2357 9410
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
Supplier updates and ownership →
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.