Series 56i wire-bond process-development platform
F&S BONDTEC Semiconductor GmbH · Packaging processes and engineering validation
- Purpose
- Wire-bond abnormalities require comparisons of recipes, loop geometry and subsequent test results.
- Technical approach
- Series 56i provides programmable loops, force and power settings with exchangeable bonding or test heads.
- Scope of use
- Use it for development and small-batch trials with manual part feeding, selecting compatible wire, tools and heads.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsHead-specific materials/tools are not interchangeable. Bonding or pull/shear tests do not validate heel-fatigue lifetime.
What to prepareBLNKK recommends preparing pad structures, wire, loop constraints and existing recipes for pull/shear, fracture-surface and post-cycle comparisons.
Confirm with the supplierConfirm selected heads, tool/material compatibility, pad access, data export and required fatigue-validation arrangements.
- Public evidence
- The official page separates ball, wedge, deep-access, heavy-wire/ribbon heads and pull/shear testing configurations.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.