Series 56i wire-bond process-development platform
Wire-bond abnormalities require comparisons of recipes, loop geometry and subsequent test results.
F&S BONDTEC Semiconductor GmbH
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View contact information ↓Public capability summary
- Whole semiconductor wire-bonding and bond-test platforms.
Other names: F&S BONDTEC · F&S Bondtec Austria
Applications: Package wire-bond development and small-lot trials
Catalog solutions · 1
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Contact information
Contact the supplier directly through its official channels.
Ask about wire-bonding equipment, bond testing or process development; include the model, wire material and test requirements. The Taiwan, China and US contacts are manufacturer-listed representatives. TEC Associates covers the US West Coast and Boston Micro-Components the East Coast. You can also use the Austrian headquarters form. Official source ↗
United States · Supplier-listed distributor · Sales inquiries
TEC Associates — San Ramon
- Phone
- +1 510 551 6700
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
HI-YEN Trading International LTD. — Taipei
- info@hiyen.com.tw
- Phone
- +886 2 2881 0962
Official source ↗Source checked
Mainland China · Supplier-listed distributor · Sales inquiries
Micro-Power Scientific Co., Ltd. — Beijing
- Phone
- +86 139 0137 7012
Official source ↗Source checked
More regional contacts (2)
Austria · Headquarters · Sales inquiries
F&S BONDTEC Semiconductor GmbH — Braunau am Inn
- info@fsbondtec.at
- Phone
- +43 7722 67052 8270
Official source ↗Source checked
United States · Supplier-listed distributor · Sales inquiries
Boston Micro-Components — Tewksbury
- Phone
- +1 781 389 3487
Official source ↗Source checked
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