FC300 high-accuracy, high-force flip-chip bonder
SET · Process equipment and thermal control
- Purpose
- Fine-pitch die bonding needs coordinated alignment, parallelism, force and thermal control to investigate placement shifts or uneven bonding.
- Technical approach
- FC300 combines optical alignment and pre-bond leveling with force and temperature control. Its listed processes include thermocompression and reflow, alongside other bonding modes for process development.
- Scope of use
- SET positions it for R&D through pilot operation, listing chip-to-chip up to 100 mm and chip-to-wafer up to 300 mm, plus 3D integration, memory stacking and silicon photonics. Specific HBM structures need confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsNominal placement accuracy and force range do not guarantee a particular specimen’s bond quality or establish wetting/electrical continuity. The page and brochure give different minimum forces; available tooling and operating conditions need confirmation.
What to prepareBLNKK suggests preparing die/substrate dimensions, bump metals and pitch, coplanarity, incoming topography and existing force–temperature–time profiles, together with post-bond alignment, electrical or cross-section results.
Confirm with the supplierConfirm specimen/tooling configuration, force and temperature controls, accuracy acceptance conditions and process atmosphere, plus support for the proposed HBM/microbump trials and pilot operation.
- Public evidence
- The product page lists ±0.3 µm post-bond accuracy, 1–4000 N force and 1 µrad pre-bond leveling; the October 2025 family brochure positions FC300 for fine-pitch R&D and pilot production.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.