FC300 high-accuracy, high-force flip-chip bonder
Fine-pitch die bonding needs coordinated alignment, parallelism, force and thermal control to investigate placement shifts or uneven bonding.
SET Corporation
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View contact information ↓Public capability summary
- High-accuracy flip-chip and chip-to-chip bonding
Other names: SET
Applications: 3D integration / memory stacking / silicon photonics / sensors · Pre-bond metal / dielectric surfaces · Chip-to-wafer / substrate direct hybrid
Catalog solutions · 3
SET-supplied ONTOS atmospheric-plasma preparation
Evaluate organic residues, surface activation and oxide treatment before bonding.
NEO HB room-temperature direct/hybrid bonding
Direct/hybrid bonding needs die-placement and post-bond displacement comparisons across the wafer.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- FC300 high-accuracy, high-force flip-chip bonder · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- NEO HB room-temperature direct/hybrid bonding · Pad misalignment and electrical opens after hybrid bonding →
- SET-supplied ONTOS atmospheric-plasma preparation · Pre-bond surface readiness and release for hybrid bonding →
Public sources
Contact information
Contact the supplier directly through its official channels.
These contacts are for France-based Smart Equipment Technology bonding equipment. DKSH Taiwan and US SETNA are listed agents; the Beijing contact is a subsidiary. Official source ↗
United States · Supplier-listed distributor · Sales inquiries
SETNA — US Sales Agent / Matt Phillips
- Phone
- +1 603 548 7870
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
DKSH Taiwan Ltd. — SET Sales Agent / Robert Wang
- Phone
- +886 921 075 612
Official source ↗Source checked
Mainland China · Supplier office
SET (Beijing) Co., Ltd. — Gen Lee
- Phone
- +86 138 1152 8811
Official source ↗Source checked
More regional contacts (1)
France · Headquarters
SET Corporation S.A. — Smart Equipment Technology / France Headquarters
- info@set-sas.fr
- Phone
- +33 4 50 35 83 92
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.