MUST3 pad solderability measurement

GEN3 Systems Limited · Packaging processes and engineering validation

Purpose: Separate BGA pad wettability from actual reflow contact conditions when investigating head-in-pillow.
Technical approach: MUST3 wetting-balance/microglobule testing contacts the sample with molten solder and records wetting-force curves.
Scope of use: Use accessible pads or representative samples; match the bath/globule, fixture and flux to surface, thermal mass and contact geometry.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
GEN3 says balled-BGA curves test fusible balls, not the underlying pads. Offline wetting does not establish assembled-joint quality; vibration/airflow affect the load cell.
What to prepare
BLNKK suggests preparing pad metallization/storage history, solder/flux versions, geometry, reflow records, controls and anomaly locations.
Confirm with the supplier
Confirm pad sampling, fixtures, bath/globule, temperature and test method. Agree on curves, repeatability and acceptance criteria; check camera/software configuration.
Public evidence: Official pages/brochure describe wetting, bare-board pads and BGA restrictions, not a specific HiP diagnosis.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.